Inspection apparatus for conductive patterns of a circuit...

Details Inspection apparatus for conductive patterns of a circuit... Inspection apparatus for conductive patterns of a circuit...

2005-03-01

2005-03-01

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S537000

Reexamination Certificate

active

06861863

ABSTRACT:
An inspection apparatus is provided capable of adequately positioning an inspection chip to a conductive pattern as an inspection object. For connecting an electrode pad1bof an inspection chip1with a lead2aof a package2, bump electrodes3and4are first provided at the inspection chip and at the package, respectively. Then, an anisotropic conductor5is provided to cover between the bump electrodes3and4, and a conductor film6is provided on the anisotropic conductor5to extend between the bump electrodes3and4. The anisotropic conductor5is thermo-compression bonded to provide an electrical connection between the conductor film6and the bump electrodes3and4. This structure may provide a desirable surface of the inspection chip1having a sufficiently reduced thickness.

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