Inspecting method, inspecting apparatus, and method of...

Details Inspecting method, inspecting apparatus, and method of... Inspecting method, inspecting apparatus, and method of...

2008-03-04

2008-03-04

Nghiem, Michael P. (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system in a specific environment

Mechanical measurement system

C702S083000

Reexamination Certificate

active

11588319

ABSTRACT:
An inspecting method is capable of efficiently inspecting a wafer. According to the inspecting method, the chip area of a wafer is inspected for defects, and based on the results, a defect density D0pof each of peripheral-zone chips in the chip area which are located closely to the peripheral area of the wafer is calculated. A peripheral-zone chip with a high defect density D0pis selected, and an area in the peripheral area which is outward of the selected peripheral-zone chip is inspected for defects. Since only the area in the peripheral area which is located outward of the peripheral-zone chip selected based on the defect density D0pis inspected for defects, the wafer is inspected efficiently.

REFERENCES:
patent: 2002/0113234 (2002-08-01), Okuda et al.
patent: 2005/0102591 (2005-05-01), Matsushita et al.
patent: 2005/0168731 (2005-08-01), Shibuya et al.
patent: 11-219997 (1999-08-01), None
patent: 2004-263391 (2004-09-01), None
patent: 2006-105946 (2006-04-01), None

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