Inspecting method for semiconductor devices

Details Inspecting method for semiconductor devices Inspecting method for semiconductor devices

1996-03-27

1997-02-25

Chaudhari, Chandra

Fishing, trapping, and vermin destroying

437212, 437226, H01L 2166

Patent

active

056058446

ABSTRACT:
A semiconductor wafer is affixed on a dicing sheet having an appropriate expansibility. Then, a dicing operation is performed on the semiconductor wafer without dividing the dicing sheet, thereby dividing a plurality of semiconductor chips from each other. After aligning a contactor against the semiconductor wafer, the semiconductor wafer is fixed to the contactor. In this case, protrusions provided on the contactor are inserted into the gap between semiconductor chips. The protrusions cause a shift movement toward the peripheral edge of the contactor in response to thermal expansion of the contactor, thereby expanding the gap between semiconductor chips. Then a burn-in is performed on all of the plural semiconductor chips of which gap is expanded.

REFERENCES:
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 5288663 (1994-02-01), Ueki
patent: 5489538 (1996-02-01), Rostoker et al.
patent: 5532174 (1996-07-01), Corrigan

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