Inspecting device for semiconductor wafer

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S394000, C250S559290

Reexamination Certificate

active

06963394

ABSTRACT:
A inspecting device for a semiconductor wafer comprises: a holding unit which holds a wafer; an aligner unit which detects a cutout position and a center position of the wafer held by the holding unit and obtains position determining data of the wafer; an observing unit for magnifying and observing fine patterns on the wafer, the observing unit being disposed at a position where the wafer held by the holding unit can be observed; a moving unit which relatively moves the holding unit with respect to the observing unit; and a control unit which controls the moving unit to move the holding unit based on the obtained position data so that the fine patterns at a desired position can be observed.

REFERENCES:
patent: 4887904 (1989-12-01), Nakazato et al.
patent: 5194743 (1993-03-01), Aoyama et al.
patent: 5258823 (1993-11-01), Akamatsu
patent: 5740034 (1998-04-01), Saeki
patent: 5851102 (1998-12-01), Okawa et al.
patent: 6201603 (2001-03-01), Miura
patent: 6222624 (2001-04-01), Yonezawa
patent: 6399957 (2002-06-01), Murata
patent: 6549290 (2003-04-01), Miura et al.
patent: 4-128605 (1992-04-01), None
patent: 9-186290 (1997-07-01), None
patent: 11-194098 (1999-07-01), None

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