Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2005-11-08
2005-11-08
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S394000, C250S559290
Reexamination Certificate
active
06963394
ABSTRACT:
A inspecting device for a semiconductor wafer comprises: a holding unit which holds a wafer; an aligner unit which detects a cutout position and a center position of the wafer held by the holding unit and obtains position determining data of the wafer; an observing unit for magnifying and observing fine patterns on the wafer, the observing unit being disposed at a position where the wafer held by the holding unit can be observed; a moving unit which relatively moves the holding unit with respect to the observing unit; and a control unit which controls the moving unit to move the holding unit based on the obtained position data so that the fine patterns at a desired position can be observed.
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Oda Tatefumi
Yamamoto Takayasu
Nguyen Sang H.
Nidek Co. Ltd.
Toatley , Jr. Gregory J.
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