Inspecting copper or molybdenum lines on a substrate

Details Inspecting copper or molybdenum lines on a substrate Inspecting copper or molybdenum lines on a substrate

1997-03-12

1998-05-26

Pianalto, Bernard

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

427123, 427125, 427155, 427256, 427322, 427352, 4273831, 427404, 427537, 427555, 427576, H05H 100

Patent

active

057561460

ABSTRACT:
Copper lines or molybdenum lines on a substrate are inspected for defects by coating a metallized substrate with an inspection layer followed by imaging the substrate, and removing the inspection layer after the imaging. The inspection layer can be a light reflecting metal or a combination of a light reflecting metal and light-absorbing organic compound.

REFERENCES:
Lee et al, Low-Cost and High-Temperature Stable Adhesion Promoter for Polymer-to-Copper Interface: Organic Compounds Containing Triazole or Imidazole Functionality, IBM Technical Disclosure Bulletin 37 (5): 221 (1994). (No month avail.).
Orbot Wafer Inspection System brochure (undated).
Viehbeck et al, Redox Seeding and Electroless Metallization of Polyimides, ACS Symposium Series 440, Metallization of Polymers: 394-414 (1990) (No month avail.).

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