Inspecting apparatus of mounted component

Details Inspecting apparatus of mounted component Inspecting apparatus of mounted component

1994-06-09

1998-03-03

Boudreau, Leo

Image analysis

Applications

Manufacturing or product inspection

382147, 382165, 348 87, 348126, G06K 900

Patent

active

057244391

ABSTRACT:
A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.

REFERENCES:
patent: 4823394 (1989-04-01), Berkin et al.
patent: 5012524 (1991-04-01), Le Beau
patent: 5023917 (1991-06-01), Bose et al.
patent: 5136948 (1992-08-01), Fujino et al.
patent: 5164994 (1992-11-01), Bushroe
patent: 5237622 (1993-08-01), Howell
patent: 5245671 (1993-09-01), Kobayashi et al.

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