Inset mechanism for electronic assemblies

Details Inset mechanism for electronic assemblies Inset mechanism for electronic assemblies

2006-01-17

2006-01-17

Nasri, Javaid H. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

06986667

ABSTRACT:
This invention relates generally to an apparatus and a method for securing electronic components, such as semiconductors and LCD devices in a mechanical assembly through an interconnection formed by a tongue-and-groove securing structure. A first element comprises a holder with electronic components mounted thereon that couples into a second element comprising a bisected frame section having two opposing grooves. The invention also embodies a method of assembly which mounts an electronic device on an insertion means, having a lower tongue and an upper tongue into a grooved frame such that sliding the lower tongue into the groove frame on the lower side situates the tongue and subsequent sliding of the tongue in the direction of the groove frame on the upper side, causes the groove to receive the upper tongue, thereby locking the tongue into the assembly.

REFERENCES:
patent: 3377514 (1968-04-01), Ruehlmann et al.
patent: 5-145249 (1993-06-01), None
patent: 11-94957 (1999-04-01), None

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