Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1991-08-30
1993-06-08
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257666, H01L 2312, H01L 2350
Patent
active
052182290
ABSTRACT:
A lead frame design having a ring which encircles the die is described which provides a bus to the semiconductor die attached thereto. The bus would be most commonly used for power or ground, although other embodiments are possible. It is known that large buses designed around the periphery of a semiconductor die can cause the corners of the die to crack, causing a variety of problems including in-circuit failures, as well as using die surface area. The invention removes the need for having a large bus on the chip and places it as an element of the lead frame. A first inventive embodiment employs tape to secure the die to the lead frame, while in a second embodiment attachment of the die to the lead frame is accomplished with no glue, tape, or eutectic means, and instead uses friction between the die and flexible support pins which extend from the ring encircling the die.
REFERENCES:
patent: 4089733 (1978-05-01), Zimmerman
patent: 4214120 (1980-07-01), Jones, Jr. et al.
patent: 4459607 (1984-07-01), Reid
patent: 4797726 (1989-01-01), Manabe
Clark S. V.
Hille Rolf
Micro)n Technology, Inc.
Protigal Stanley N.
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