Insertion of electrical component within a via of a printed...

Details Insertion of electrical component within a via of a printed... Insertion of electrical component within a via of a printed...

2006-01-10

2006-01-10

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S833000, C029S834000, C029S842000, C029S852000, C174S262000, C361S760000

Reexamination Certificate

active

06983535

ABSTRACT:
A method for reducing the impedance of a reference path in a printed circuit board includes forming a printed circuit board having a plurality of conductive layers including first, second, third, and fourth layers. The printed circuit board includes two or more vias interconnecting two or more of the conductive layers. A first via is part of a signal path configured to carry a signal from the first layer to the second layer. A second via is part of a reference path configured to carry said signal from a third layer to a fourth conductive layer. The method further includes embedding an electrical component, such as a capacitor, in the second via between two of the conductive layers.

REFERENCES:
patent: 4800459 (1989-01-01), Takagi et al.
patent: 5055966 (1991-10-01), Smith et al.
patent: 6388890 (2002-05-01), Kwong et al.
patent: 6621012 (2003-09-01), Crockett et al.
patent: 6625880 (2003-09-01), Nabemoto et al.
patent: 6809268 (2004-10-01), Hayashi et al.

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