Insert for use in transporting a wafer carrier

Details Insert for use in transporting a wafer carrier Insert for use in transporting a wafer carrier

2000-01-12

2002-06-11

Yu, Mickey (Department: 3728)

Special receptacle or package

Holder for a removable electrical component

For a semiconductor wafer

C206S454000, C211S041180

Reexamination Certificate

active

06401929

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates generally to semiconductor fabrication, and more specifically to apparatus for storing and transporting semiconductor wafers.
DESCRIPTION OF THE RELATED ART
FIG. 1
shows a conventional assembly
10
for transporting semiconductor wafers
40
. A container
20
has a box bottom
22
and a box cover
24
. Inside the container
20
is a wafer carrier or cassette
30
that holds a plurality of semiconductor wafers
40
. The wafer carrier
30
is a tray having a plurality of slots formed between adjacent pairs of ribs
34
. Although only one pair of ribs
34
is visible in
FIG. 1
, one of ordinary skill understands that a plurality of ribs are arranged from front to back in planes parallel to the ribs
34
shown in
FIG. 1. A
respective slot is formed between each successive set of ribs
34
. Each slot is capable of storing a respective wafer
40
. Although only one wafer
40
is shown in
FIG. 1
, one of ordinary skill understands that a plurality of wafers are arranged from front to back in planes parallel to wafer
40
. The box
20
with the wafer carrier
30
and wafers
40
inside may be transported between different processing stations, typically on wheeled carts.
The exemplary wafer carrier
30
also has right and left rearwardly projecting tabs
36
on its bottom, extending in a direction perpendicular to the plane of
FIG. 1. A
pair of stiffening ribs
38
are integrally formed at the front and rear ends of the wafer carrier
30
. A structural cross member
32
is provided in the front of the wafer carrier
30
, and a similar cross member is present in the back. The wafer carrier
30
is typically made from a carbon impregnated polypropylene material or similar material. Exemplary wafer carrier systems such as that shown in
FIG. 1
are manufactured by Entegres, Inc., Chaska, Minn. (formerly Fluoroware, Inc.).
Because they contain a large number of wafers
40
in known positions, the wafer carriers
30
are useful in automated semiconductor processing. The wafers
40
can be automatically removed from the wafer carrier
30
for processing in an automated wafer processing system (not shown). For example, an ion implant system includes various wafer handling mechanisms for transferring semiconductor wafers into and out of the ion implanter. Some ion implant systems include a wafer clamp for transferring semiconductor wafers from the wafer carrier in which they are stored, onto an ion implanter disk. The wafer clamp grasps the wafer while it is disposed in the carrier, removes it from the carrier, and places it on the ion implanter disk.
Experience with wafer handling systems has shown that, after transport, upon removal from the wafer carrier, wafers often have an unacceptable number of contaminant particles on their surfaces. These contaminant particles interfere with the processing of the wafers.
An improved method and system for handling semiconductor wafers is desired.
SUMMARY OF THE INVENTION
One aspect of the invention is an insert for a container. The container is shaped to contain a wafer carrier during transport. The wafer carrier is shaped to hold a plurality of semiconductor wafers. The insert has a size and shape so as to snugly fit in a predetermined position in the container. The insert has at least one mounting feature to snugly hold the wafer carrier.
Another aspect of the invention is an assembly for storing semiconductor wafers, including: a container, a wafer carrier and a plate to which the wafer carrier is attached. The wafer carrier fits in the container. The wafer carrier has a plurality of slots, each slot capable of receiving a semiconductor wafer. The plate has a size and shape so as to snugly fit in a predetermined position in the container and substantially prevent movement of the wafer carrier relative to the container.
Another aspect of the invention is a method for handling at least one semiconductor wafer. an insert is snugly fitted in the bottom of a container. A wafer carrier is mounted on the insert. At least one semiconductor wafer is inserted in the wafer carrier. The container is transported with the insert, wafer carrier and at least one wafer contained therein.
The above and other features of the present invention will be better understood from the following detailed description of the exemplary embodiment of the invention which is provided in connection with the accompanying drawings.


REFERENCES:
patent: 3172132 (1965-03-01), Mucha
patent: 4779732 (1988-10-01), Boehm et al.
patent: 5255797 (1993-10-01), Kos
patent: 5273159 (1993-12-01), Gregerion
patent: 5346518 (1994-09-01), Baseman et al.
patent: 5988393 (1999-11-01), Hsia et al.
patent: 6003674 (1999-12-01), Brooks
Copy of Image of USPTO Shoe Insert.*
Dupont Delrin Acetal Resin, Product and Properties Guide, p. 1-15.
DuPont Engineering Polymers, Delrin Acetal Resin, p. 1-2.
Fluoroware, 150mm Wafer Handling, p. 1-2.
Fluoroware, Wafer Management, p. 1-2.
Fluoroware, Wafer Shipping, p. 1-2.
Flluoroware, Voyager Wafer Shipping Systems, p. 1-2.

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