Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-10-12
1995-08-15
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174256, 174257, 174259, 174260, 361779, 439 78, H05K 100
Patent
active
054421454
ABSTRACT:
A terminal for an electric circuit device, comprises a copper core, a gold (Au) layer provided over the copper core, and a nickel (Ni) layer having the thickness of 1.5 .mu.m or less, provided under the gold (Au) layer. In another embodiment, the core is made of an alloy containing (Ni) and covered by a metallized surface layer made of copper.
REFERENCES:
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5041901 (1991-08-01), Kitano et al.
patent: 5332869 (1994-07-01), Hagiwara
M. Terasawa et al., "A Comparison of Thin Film, Thick Film, and Co-Fired High Density Ceramic Multilayer With The Combined Technology" The International Journal For Hybrid Microelectronics, vol. 6, pp. 607-615, (1983).
Burger et al., "Multi-Layer Ceramics Manufacturing", IBM J. Res. Develop., vol. 27:17-18, (1983).
Imai Ryuji
Takada Toshikatsu
Figlin Cheryl R.
NGK Spark Plug Co. Ltd.
Picard Leo P.
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