Input/output structure and integrated circuit using the same

Details Input/output structure and integrated circuit using the same Input/output structure and integrated circuit using the same

2005-12-06

2005-12-06

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular chip input/output means

C257S208000, C257S459000, C257S676000, C257S690000, C257S784000, C257S786000

Reexamination Certificate

active

06972445

ABSTRACT:
An input/output structure for a die to support an Accelerated Graphic Port (AGP) standard and a Peripheral Component Interconnection Express (PCIE) standard is provided. The I/O structureis suitable for the die pad. It comprises: a PCIE input/output pad for supporting PCIE standard; an AGP input/output pad for supporting AGP standard; a die pad coupled to an external circuit; a first conducting distributed wire coupled to the PCIE input/output pad and the die pad; and a second conducting distributed wire coupled to the AGP input/output pad and the die pad; wherein only one of the PCIE input/output pad and the AGP input/output pad is enabled at the same time.

REFERENCES:
patent: 6043539 (2000-03-01), Sugasawara
patent: 6242814 (2001-06-01), Bassett

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