Input/output pads placement for a smart card chip

Details Input/output pads placement for a smart card chip Input/output pads placement for a smart card chip

2007-01-10

2011-12-20

Walsh, Daniel (Department: 2887)

Registers

Records

Conductive

C235S380000, C235S487000, C235S493000, C257S491000, C257S679000, C257S691000

Reexamination Certificate

active

08079528

ABSTRACT:
A chip for a smart card including a plurality of electrical contacts for communication of data with a smart card reader is disclosed. In one embodiment, a chip for a smart card includes a core circuit and a plurality of input/output pads corresponding to said set of electrical contacts, wherein said input/output pads are divided into at least a first column and a second column placed immediately adjacent to the first column, such that the first and second columns form a cluster. In another embodiment, eight input/output pads are divided into two columns, placed immediately adjacent to each other. The cluster may be partially surrounded by the core circuit. The chip may further comprise an ESD network, comprising VDD and GND buses for improved ESD protection while reducing the size of the chip.

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