Inorganic compound particle

Details Inorganic compound particle Inorganic compound particle

2009-04-20

2011-10-04

Kiliman, Leszek (Department: 1788)

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

C428S404000, C428S405000, C428S406000, C428S407000

Reexamination Certificate

active

08029898

ABSTRACT:
Inorganic compound particles constituted of a shell, a porous matter or a cavity enclosed therein, and the porous matter or the cavity being kept unchanged in a subsequently formed transparent coating film.

REFERENCES:
patent: 5258212 (1993-11-01), Tomaru et al.
patent: 5965975 (1999-10-01), Chigusa et al.
patent: 6040053 (2000-03-01), Scholz et al.
patent: 6132773 (2000-10-01), Amiche
patent: 6136228 (2000-10-01), Hirai et al.
patent: 6180030 (2001-01-01), Hirai et al.
patent: 6184125 (2001-02-01), Chigusa et al.
patent: 6261214 (2001-07-01), Meguriya
patent: 6274648 (2001-08-01), Meguriya et al.
patent: 6552096 (2003-04-01), Meguriya
patent: 6777069 (2004-08-01), Ito et al.
patent: 7575803 (2009-08-01), Hirai et al.
patent: 2003/0130363 (2003-07-01), Meguriya
patent: 6151101 (1986-03-01), None
patent: 07133105 (1995-05-01), None
patent: 10040834 (1998-02-01), None
JP 03100059A, Sep. 1989, English Abstract.
JP 01238963A, Apr. 1991, English Abstract.
JP 2002-079616A, Mar. 2002, English Abstract.
Database XP-002180783 Derwent Publications Ltd., Catalysts & Chem. Ind. Co. Ltd., Dec. 21, 1998.
CN 1216567, English Abstract, Inventor: F. Amiche, entitled “Method for Preparing Particles Comprisnig a Core and a Silica Shell”, publication date: May 12, 1999.

Affiliated with

Also associated with

Rating

Inorganic compound particle does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inorganic compound particle, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inorganic compound particle will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4292269