Inner lead bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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Details

228 62, 228 491, H01L 2160, B23K10140

Patent

active

052073696

ABSTRACT:
A process for manufacturing electronic components known as TAB method comprises a process employing a single apparatus for forming bumps in a chip, a process of inner lead bonding for bonding said bumps to leads of a film carrier, and a process of outer lead bonding for bonding the leads to a circuit board after punching said film carrier. The bumps are formed by plating means or by stud bump means using a capillary tool. In another aspect of the invention there is provided an apparatus by which it is possible to form the bumps and to perform the inner lead bonding in a single apparatus. The capillary tool for forming the inner lead bonding and a pressing tool for the inner lead bonding are replaceably and selectively mounted to be held on a horn. Also, there are provided a pickup head for moving the chip furnished in a chip feeding unit to the chip stage and a moving table for moving the chip stage. The capillary tool is held by the horn, and the bumps are formed in the chip on the chip stage while pulling out a wire from the capillary tool. Next, the pressing tool is manually mounted to be held by the horn in place of the capillary tool, and the leads of the film carrier on the chip stage are bonded to the bumps formed in the chip.

REFERENCES:
patent: 3384283 (1968-05-01), Mims
patent: 4050618 (1977-09-01), Angelucci et al.
patent: 4893742 (1990-01-01), Bullock
patent: 5060843 (1991-10-01), Yasuzato et al.

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