Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-12-22
2011-10-18
Levi, Dameon (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S666000, C174S536000
Reexamination Certificate
active
08040690
ABSTRACT:
An inner-connecting structure of a lead frame. The lead frame includes a metal frame having a plurality of leads. The inner-connecting structure of the lead frame includes an insulation film arranged on some of those leads, covering a portion of a first surface of the lead; a plurality of holes formed on the insulation film to expose some of those leads, wherein the hole exposes a portion of the first surface of the lead; and a conductive element selectively connecting the exposed portion of those leads electrically. Besides, an inner-connecting method of the lead frame is also disclosed herein. The insulation film is utilized to separate the conductive element from the lead frame so that the leads can be easily interconnected with each other.
REFERENCES:
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patent: 5337216 (1994-08-01), McIver
patent: 5461202 (1995-10-01), Sera et al.
patent: 6630732 (2003-10-01), Corisis
patent: 7023315 (2006-04-01), Yeo et al.
patent: 2005/0142694 (2005-06-01), Chiou et al.
Levi Dameon
Muncy Geissler Olds & Lowe, PLLC
Powertech Technology Inc.
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