Inline physical shape profiling for predictive temperature...

Details Inline physical shape profiling for predictive temperature... Inline physical shape profiling for predictive temperature...

2006-09-27

2008-09-16

Paik, Sang Y (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S725000

Reexamination Certificate

active

07425689

ABSTRACT:
The post exposure bake cycle in a chemically amplified resist process is more precisely controlled by measuring the distance from multiple locations on the bottom of each processed wafer to a reference plane surface while the wafer is supported on a cool plate. Subsequent to measuring the distance, the wafers are transferred to the hot plate that has a series of controllable heating elements. The set temperature for the heating elements is established in response to the distances measured while the wafer is on the cooling plate. The measurements are taken by utilizing proximity sensors located within the cooling plate.

REFERENCES:
patent: 5941083 (1999-08-01), Sada et al.
patent: 6072162 (2000-06-01), Ito et al.
patent: 6191394 (2001-02-01), Shirakawa et al.
patent: 6240874 (2001-06-01), Pike
patent: 6402509 (2002-06-01), Ookura et al.
patent: 6443641 (2002-09-01), Takamori et al.
patent: 6478578 (2002-11-01), Choi et al.
patent: 6499777 (2002-12-01), Wang
patent: 6863734 (2005-03-01), Takano
patent: 6992270 (2006-01-01), Lee et al.
patent: 7094994 (2006-08-01), Oyama et al.
Smith et al., Modeling the impact of thermal history during post exposure bake on the lithographic performance of chemically amplified resists, Advances in Resist Technology and Processing XVIII, Francis M. Houlihan, Editor, Proceedings of SPIE, pp. 1013-1021, 2001, vol. 4345.
Shiobara et al., A novel post exposure bake temperature control to improve CD uniformity over product wafers, Fuji Film Interface 2005 Conference, San Diego, CA, Oct. 25, 2005, 24 pgs.

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