Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2004-09-23
2008-09-30
Nguyen, Lamson D (Department: 2861)
Etching a substrate: processes
Forming or treating thermal ink jet article
Reexamination Certificate
active
07429336
ABSTRACT:
A method of making an inkjet printhead comprising providing a substrate having first and second opposite surfaces, providing a support member, bonding the second surface of the substrate to the support member, and, after the substrate and support member are bonded together, forming a plurality of ink ejection elements on the first surface of the substrate, the method further including forming communicating ink supply slots passing respectively through the substrate and support member to provide fluid communication between an ink supply and the ink ejection elements.
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Kneezel, G.A. et al., “Corrosion-Resistant Heat Sinking Substrate For Thermal Ink Jet Printheads,” Xerox Disclosure Journal, Xerox Corporation, US, vol. 22, No. 6, (Nov. 1, 1997).
EP 03 10 3539, “Search Report”, Feb. 4, 2004.
Annett Laura
Keenan Phil
McCabe Declan John
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