Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate
2007-02-13
2007-02-13
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Interconnecting plural devices on semiconductor substrate
C438S021000, C438S149000
Reexamination Certificate
active
10175954
ABSTRACT:
A method for forming an integrated circuit including at least two interconnected electronic switching devices, the method comprising forming at least part of the electronic switching devices by ink-jet printing.
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Friend Richard Henry
Kawase Takeo
Sirringhaus Henning
Kebede Brook
Nguyen Khiem
Plastic Logic Limited
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