Ink jet recording head and method of producing the same

Details Ink jet recording head and method of producing the same Ink jet recording head and method of producing the same

1994-08-10

1996-12-31

Lund, Valerie A.

Incremental printing of symbolic information

Ink jet

Ejector mechanism

347 70, 347 71, B41J 2025

Patent

active

055898602

ABSTRACT:
Both a cavity plate and a vibrating plate are made of polyether imide resin, and a polysulfone resin film having a thickness of 3 .mu.m is formed on one or both of the joining faces of the plates. The melt temperature of polysulfone resin is about 190.degree. C., and the heat deformation temperature of polyether imide resin is about 200.degree. C. When the cavity plate and the vibrating plate are contacted with each other through the polysulfone resin films and then heated at 190.degree. C. for one hour, therefore, the polysulfone resin films are fused to become a fused layer so that the plates are firmly joined. Since the heat deformation temperature of the cavity plate is 200.degree. C. which is higher by 10.degree. C. than the melt temperature (190.degree. C.) of the polysulfone resin films, the fusion does not cause ink flow paths of nozzles, etc. to be heat-deformed.

REFERENCES:
patent: 5396042 (1995-03-01), Ishida et al.
F. P. Giordano and R. Lane, "Noncorrosive Bonding Technique for Silicon Nozzles in Ink Jet Printing," IBM Technical Disclosure Bulletin, vol. 19, No. 7, Dec. 1976, pp. 2790-2791.
M. Wild, "Bilayer Aperture Plate Bonding," Xerox Disclosure Journal, vol. 8, No. 2, Mar./Apr. 1983, p. 89.

Affiliated with

Also associated with

Rating

Ink jet recording head and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ink jet recording head and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ink jet recording head and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1145010