Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead
Reexamination Certificate
2007-03-13
2007-03-13
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Manufacture of electrical device controlled printhead
C347S044000
Reexamination Certificate
active
11208885
ABSTRACT:
In order to that stress generated within a resin can be suppressed and cracking in the resin can be prevented, an ink jet recording head comprising a substrate; a resin body, which defines an ink discharge section, formed on the substrate; and a heating resistor provided on the substrate, an ink chamber being formed between the heating resistor and the ink discharge section, the resin body being dug down along the ink chamber, is provided.
REFERENCES:
patent: 6921152 (2005-07-01), Fukunaga et al.
patent: 5-330066 (1993-12-01), None
patent: 6-286149 (1994-10-01), None
patent: 2000-351214 (2000-12-01), None
Fukunaga Hideki
Ikeda Hiroshi
Usami Hiroyuki
Coleman W. David
Fuji 'Xerox Co., Ltd.
Morgan & Lewis & Bockius, LLP
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