Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1985-05-10
1987-05-26
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427436, 427437, 4274431, 427404, 427405, 427304, 427305, 427306, 346 75, C23C 1828, H05K 318
Patent
active
046685332
ABSTRACT:
Imagewise deposition of ink onto a substrate such as a circuit board, by ink jet technology, to produce a metal-imaged circuit board.
REFERENCES:
patent: 3060429 (1962-10-01), Winston
patent: 3298030 (1967-01-01), Lewis et al.
patent: 3373437 (1968-03-01), Sweet et al.
patent: 3416153 (1968-12-01), Hertz et al.
patent: 3668003 (1972-06-01), Furness
patent: 3673601 (1972-06-01), Hertz
Feldstein "Selective Electroless Plating Techniques: A Survey" Plating, Aug. 1970.
Keeling, Phys. Technol. 12:196 (1981).
Kuhn et al., Scientific American, Apr. 1979, p. 162.
Vest et al., Intl. J. Hybrid Microelectronics 6:261 (1983).
Coombs, Printed Circuits Handbook (McGraw-Hill, New York 1979), pp. 7.1-7.9, 22.12-22.13.
Horkans et al., IBM J. Res. Develop. 28:690 (1984).
Costello James A.
E. I. Du Pont de Nemours and Company
Smith John D.
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