Ink jet printhead with improved adhesive bonding between channel

Details Ink jet printhead with improved adhesive bonding between channel Ink jet printhead with improved adhesive bonding between channel

1998-01-08

1999-02-16

Breneman, Bruce

Etching a substrate: processes

Forming or treating thermal ink jet article

216 33, 216 34, B11B 527

Patent

active

058716572

ABSTRACT:
An improved process is provided for aligning and bonding channel and heater substrates together to form a thermal ink jet printhead. A thick film polyimide layer is formed over the heater substrate and is patterned to provide a plurality of tacking pits. The channel substrate has alignment holes formed in peripheral edge areas. A UV curable adhesive is deposited into the alignment hole and UV irradiated to produce a cured tacking column in the underlying pits formed in the thick film layer. Due to the sloping walls of the etched alignment recess, some portion of the adhesive is not fully cured and, during a subsequent curing process, tends to initiate a capillary flow along the interface between channel substrate and the thin film layer. This flow, in prior art designs, sometimes proceeds to the point where the adhesive is squeezed out onto electrode connections formed on an adjacent heater substrate. The formation of the pits serves to interrupt and trap the flow of the uncured adhesive, thus, preventing further flow and eliminating subsequent contamination.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4678529 (1987-07-01), Drake et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 5368683 (1994-11-01), Altavela et al.

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