Ink-jet printhead fabrication

Details Ink-jet printhead fabrication Ink-jet printhead fabrication

2006-01-27

2009-08-04

Hoang, Quoc D (Department: 2892)

Semiconductor device manufacturing: process

Manufacture of electrical device controlled printhead

C438S672000, C257SE21620, C257SE21621

Reexamination Certificate

active

07569404

ABSTRACT:
A silicon wafer substrate is used in ink-jet printhead fabrication. The fabrication process is improved by simultaneously forming MOSFET source/drain contact vias simultaneously with substrate contact vias. A dry etch having a silicon oxide:silicon etch rate of at least 10:1 is employed.

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