Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1996-07-12
1998-03-03
Powell, William
Etching a substrate: processes
Forming or treating thermal ink jet article
216 2, 216 33, H01L 2100
Patent
active
057230536
ABSTRACT:
An ink jet printer head includes a spacer including pressure generating chambers continuous to nozzle openings, ink supply paths, and reservoirs, a cover member for covering the pressure generating chambers in a sealing fashion, and pressure generating means for generating pressure in the pressure generating chambers in accordance with print data. In processing a silicon single-crystal substrate vertically oriented in (110) by anisotropic etching process, one of the walls of a path hole for forming a pressure generating chamber is aligned with one of the walls of a path hole for forming a reservoir. Walls defining the path hole for forming a pressure generating chamber, which are located in the vicinity of a nozzle opening, are connected to each other at an obtuse angle. As a result, the ink supply path serving as a narrow path for ink flow and the pressure generating chamber are formed as smooth flow paths. The walls in an area in the vicinity of the nozzle opening where ink tends to stay are substantially equally distanced from the nozzle opening. A smooth flow of ink is ensured.
REFERENCES:
patent: 4047184 (1977-09-01), Bassous et al.
patent: 4216477 (1980-08-01), Matsuda et al.
patent: 4312008 (1982-01-01), Taub et al.
patent: 4600934 (1986-07-01), Aine et al.
patent: 5096535 (1992-03-01), Hawkins et al.
Furuta Tatsuo
Kamoi Kazumi
Katakura Takahiro
Miura Kazuhiko
Momose Kaoru
Powell William
Seiko Epson Corporation
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