Printing – Processes – Condition responsive
Patent
1997-06-27
1999-03-23
Fisher, J. Reed
Printing
Processes
Condition responsive
101365, B41F 3104
Patent
active
058845623
ABSTRACT:
In an ink film thickness control method for an ink supply apparatus including an ink fountain for storing an ink, a plurality of ink fountain keys whose aperture ratios are independently adjusted to supply said ink in said ink fountain, an ink fountain roller to which said ink is supplied through said ink fountain keys, and an ink ductor roller for supplying said ink supplied to said ink fountain roller to a printing plate through an ink roller group in accordance with a feed operation, the feed operation of said ink ductor roller is set in an OFF state when said printing plate is to be exchanged. A printing press in which said previous printing plate is kept mounted is operated without performing the feed operation of said ink ductor roller, thereby rotating said ink roller group. Printing is performed on a predetermined number of paper sheets using said previous printing plate to leave a first minimum ink film thickness distribution necessary for printing such that an ink film becomes thinner from an upstream to a downstream.
REFERENCES:
patent: 4660470 (1987-04-01), Kramp et al.
patent: 5010820 (1991-04-01), Loffler
patent: 5070784 (1991-12-01), Nishida et al.
patent: 5081926 (1992-01-01), Rodi
patent: 5148747 (1992-09-01), Rodi et al.
patent: 5174210 (1992-12-01), Rodi et al.
patent: 5447102 (1995-09-01), Pfeiffer et al.
Hama Teruhiko
Sugiyama Hiroyuki
Fisher J. Reed
Komori Corporation
LandOfFree
Ink film thickness control method for ink supply apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ink film thickness control method for ink supply apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ink film thickness control method for ink supply apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2116169