Ink ejection device including a silicon chip having a heater...

Details Ink ejection device including a silicon chip having a heater... Ink ejection device including a silicon chip having a heater...

2011-04-12

2011-04-12

Luu, Matthew (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

Reexamination Certificate

active

07922297

ABSTRACT:
A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.

REFERENCES:
patent: 2005/0168534 (2005-08-01), Beak
IC Knowledg Glossary-F and Semiconductor One Source—Semiconductor Glossary—Search for—bpsg.

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