Ink composition for an ultra-thick thick film for thermal manage

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428613, 428620, 428624, 428626, 428632, 428637, 428687, 428209, B32B 900

Patent

active

055276270

ABSTRACT:
An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.

REFERENCES:
patent: 4612601 (1986-09-01), Watari
patent: 5121298 (1992-06-01), Sarma et al.
patent: 5173839 (1992-12-01), Metz, Jr.
U.S. patent application Ser. No. 08/038,379. Myers et al., filed Mar. 29, 1993.
449--F&M Fienwerktechnik & Messtechnik 98 (1990) Nov., No. 11, Munchen, DE.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ink composition for an ultra-thick thick film for thermal manage does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ink composition for an ultra-thick thick film for thermal manage, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ink composition for an ultra-thick thick film for thermal manage will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-221743

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.