Injection plating apparatus

Details Injection plating apparatus Injection plating apparatus

1993-12-01

1995-05-23

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204275, C25D 502, C25D 1700, C25D 2110

Patent

active

054178304

ABSTRACT:
An injection plating apparatus for uniformly plating external leads of a semiconductor product having a lead-missing portion. The injection plating apparatus comprises cavity boxes for compressing a semiconductor product. Masks, attached to the cavity boxes, serve as masks in plating injection for covering at least a lead-missing portion of the semiconductor product. The injection plating apparatus further comprises means for plating the external leads of the semiconductor product.

REFERENCES:
patent: 3695909 (1972-10-01), Fabre et al.
patent: 4339319 (1982-07-01), Aigo
patent: 4518636 (1985-05-01), Richards
patent: 5228966 (1993-07-01), Murata

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