Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2007-04-03
2007-04-03
Lam, Cathy F. (Department: 1775)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S684000, C257S701000, C257S702000
Reexamination Certificate
active
10750181
ABSTRACT:
The invention relates to an injection moulded product comprising an attached body which has been attached by an intermediate layer. The body has been attached to the injection moulded product by an intermediate layer attached to the body prior to the injection moulding. The invention also relates to a method for the manufacture of an injection moulded product comprising a body which has been attached by an intermediate layer.
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Krappe Anu
Strömberg Samuli
Fitch Even Tabin & Flannery
Lam Cathy F.
Rafsec Oy
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