Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or...
Reexamination Certificate
2007-12-21
2010-11-02
Heitbrink, Tim (Department: 1791)
Plastic article or earthenware shaping or treating: apparatus
Control means responsive to or actuated by means sensing or...
C425S143000, C425S144000
Reexamination Certificate
active
07824163
ABSTRACT:
An injection molding system includes a mold having a hot half and a cold half, the hot half including a hot runner. A bus transceiver is located in the mold. At least one electrical device associated with the operation of the mold is located in the mold and electrically coupled to the bus transceiver. A controller for controlling the mold is located outside the mold. A bus line electrically couples the controller to the bus transceiver of the electrical device apparatus includes an injection manifold having an inlet and a melt channel.
REFERENCES:
patent: 4726751 (1988-02-01), Shibata et al.
patent: 4899288 (1990-02-01), Tsutsumi
patent: 5229952 (1993-07-01), Galloway et al.
patent: 5320513 (1994-06-01), Schmidt
patent: 5552998 (1996-09-01), Datta
patent: 5591366 (1997-01-01), Schmidt
patent: 5795511 (1998-08-01), Kalantzis et al.
patent: 5853631 (1998-12-01), Linehan
patent: 6272398 (2001-08-01), Osborne et al.
patent: 6529796 (2003-03-01), Kroeger et al.
patent: 6606251 (2003-08-01), Kenny et al.
patent: 6670830 (2003-12-01), Otsuka et al.
patent: 6674006 (2004-01-01), Linehan et al.
patent: 6813537 (2004-11-01), Linehan et al.
patent: 6913453 (2005-07-01), Kalantzis
patent: 6936199 (2005-08-01), Olaru
patent: 7020540 (2006-03-01), Linehan et al.
patent: 7066725 (2006-06-01), Zufle
patent: 7154300 (2006-12-01), Anders et al.
patent: 7245834 (2007-07-01), Vigier-Blanc et al.
patent: 7456778 (2008-11-01), Werner et al.
patent: 2006/0081719 (2006-04-01), Nguyen
patent: 2006/0082010 (2006-04-01), Saggese et al.
patent: 102 24 414 (2003-08-01), None
patent: 10 2004 052499 (2006-07-01), None
patent: 10 2006 009 808 (2006-07-01), None
patent: 10 2006 009808 (2007-07-01), None
patent: 63-098007 (1998-04-01), None
patent: 2000-263597 (2000-09-01), None
patent: 2002-001785 (2002-01-01), None
patent: WO-01/07229 (2001-02-01), None
patent: WO-2007/092474 (2007-08-01), None
Heitbrink Tim
Medler Ferro PLLC
Mold-Masters (2007) Limited
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