Injection molding method and injection molding apparatus

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Reexamination Certificate

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Details

C264S040300, C264S328100, C264S500000

Reexamination Certificate

active

07935293

ABSTRACT:
An injection molding apparatus includes a forming mold provided with a gas inlet through which a gas is introduced into an area between a rear molding surface in a cavity and a resin material inside the cavity. A plurality of the gas inlets is provided along a passage direction of the resin material in the cavity. In injection molding the resin molded article, a molten resin material is introduced into the cavity from a resin inlet and, when filling the inside of the cavity with the resin material, the introduction of the gas is sequentially started, beginning with a gas inlet provided in an area inside the cavity which is first filled with the resin material, thereby sequentially pressing the relevant resin material against a front molding surface of the cavity.

REFERENCES:
patent: 5198240 (1993-03-01), Baxi
patent: 5344596 (1994-09-01), Hendry
patent: 5439365 (1995-08-01), Hendry
patent: 5542611 (1996-08-01), Hendry
patent: 5716560 (1998-02-01), Heuchert et al.
patent: 6403014 (2002-06-01), Hendry et al.
patent: 7582250 (2009-09-01), Uchida et al.
patent: 2003/0224080 (2003-12-01), Thomas
patent: 2004/0004313 (2004-01-01), Thomas
patent: 2004/0191475 (2004-09-01), Murayama
patent: A-59-220337 (1984-12-01), None
patent: A-63-281818 (1988-11-01), None
patent: A-06-23781 (1994-02-01), None
patent: A-07-223246 (1995-08-01), None
patent: A-08-72109 (1996-03-01), None
patent: A-08-281685 (1996-10-01), None
patent: A-09-76247 (1997-03-01), None
patent: A-9-109213 (1997-04-01), None
patent: A-10-86169 (1998-04-01), None
patent: A-2000-280830 (2000-10-01), None
patent: A-2000-289046 (2000-10-01), None
patent: A-2002-283415 (2002-10-01), None
patent: A-2005-28731 (2005-02-01), None
Notification of Reason for Refusal issued from the Japanese Patent Office dated Jul. 16, 2010 in the corresponding Japanese patent application No. 2005-345555 (a copy and English translation thereof).
Notification of Reason for Refusal issued from the Japanese Patent Office dated Jul. 16, 2010 in the corresponding Japanese patent application No. 2005-345556 (a copy and English translation thereof).

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