Injection molding equipment for encapsulating semiconductor die

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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4251291, 425190, 425192R, 425544, 425549, 425552, 425569, 425572, 425588, 425DIG51, 26427217, B29C 4502, B29C 4520, B29C 4527, B29C 4538

Patent

active

058767657

ABSTRACT:
A device for encapsulating a plurality of semiconductor die comprises a form having first and second halves such that as the first half contacts the second half the first and second halves have a plurality of cavities therein. The first and second halves each comprise a conduit therein for receiving a heated liquid. The device further comprises a runner block having a hole therein, a separate runner for each cavity, and a conduit therein for receiving a heated liquid. The runners have a rectangular cross section and a width to height ratio of at least 3:1. The device further comprises a mounting plate for mating with the runner block. The mounting plate comprises a concave recess and a hole in the mounting plate at the recess. The hole in the mounting plate passes through the mounting plate to align with the hole in the runner block such that an encapsulation material can be passed between the mounting plate and the runner block. The device further comprises a heated nozzle having a hole therethrough and a convex head wherein the concave recess is adapted to receive the convex head such that an encapsulation material can be passed between the nozzle and the mounting plate. The device further comprises a spring which urges the nozzle away from the mounting plate.

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Plastics Technology, 27, No. 4, p. 22 (Apr. 1981)"Hollow-Spres Process Thermosetting Molding Cycles"
Prost, Plastics Technology, 27, No. 5, pp. 67-69, (May 1981)"Hyperthermal Runner System".

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