Plastic and nonmetallic article shaping or treating: processes – With severing – removing material from preform mechanically,... – Making hole or aperture in article
Patent
1996-12-10
1998-11-10
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
With severing, removing material from preform mechanically,...
Making hole or aperture in article
264154, 26427214, 26427217, 264273, 264274, B29C 7074, B29C 7078, B29C 4514
Patent
active
058339035
ABSTRACT:
A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.
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Great American Gumball Corporation
Ortiz Angela
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