Injection molding apparatus and blow-molding apparatus using sai

Details Injection molding apparatus and blow-molding apparatus using sai Injection molding apparatus and blow-molding apparatus using sai

1995-01-30

1996-07-30

Heitbrink, Tim

Plastic article or earthenware shaping or treating: apparatus

Female mold and means to shape parison directly by internal...

Plural female molds and means to shape parison at each...

2642972, 425540, 425574, B29C 4906

Patent

active

055405800

ABSTRACT:
An injection molding apparatus in which a hot-runner mold is moved with respect to the injection nozzle of an injection unit is disclosed. In a position in which the injection nozzle comes into contact is provided a first fixed link with a runner formed therein. A second fixed link with a runner formed therein is fixed to the hot-runner mold, and moves integrally with the hot-runner mold. Between these links is provided an intermediate runner block system, with runners formed therein. The intermediate runner block system is constructed from a first intermediate link supported rotatably by the first fixed link and a second intermediate link supported rotatably by the second fixed link, and these two intermediate links are also rotatably coupled together. This plurality of links forms a link construction, so that regardless of the movement of the hot-runner mold the resin path between the injection nozzle and the hot-runner mold is maintained.

REFERENCES:
patent: 5030406 (1991-07-01), Sorensen

Affiliated with

Also associated with

Rating

Injection molding apparatus and blow-molding apparatus using sai does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Injection molding apparatus and blow-molding apparatus using sai, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Injection molding apparatus and blow-molding apparatus using sai will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1654456