Injection molding and temperature conditioning apparatus

Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or... – Article ejector or stripper control

Reexamination Certificate

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Details

C425S444000, C425S547000

Reexamination Certificate

active

07946836

ABSTRACT:
An injection molding machine and a mold are used to form batches of hallow parts, such as PET preforms. An end of arm tool transfers the molded preforms from the mold to a temperature conditioning station having a conveyor. The batch of molded preforms is received and retained on the end of arm tool by an array of cooling tubes that are attached to a number of identical cooling tubes carrier devices. The conveyor is adapted to receive the carrier devices and the cooling tubes loaded with molded preforms from the end of arm tool. The conveyor is also adapted to transfer rapidly the carrier devices and the empty cooling tubes into the end of arm tool before the end of arm tool is moved back into the molding area to receive subsequent batches of molded preforms.

REFERENCES:
patent: 3488801 (1970-01-01), Hartely
patent: 3882213 (1975-05-01), Uhlig
patent: 4140464 (1979-02-01), Spurr
patent: 4197073 (1980-04-01), Rees
patent: 4209290 (1980-06-01), Rees
patent: 4313720 (1982-02-01), Spurr
patent: 4313905 (1982-02-01), Hafele
patent: 4356142 (1982-10-01), Germanio
patent: 4382760 (1983-05-01), Wiatt et al.
patent: 4382905 (1983-05-01), Valyi
patent: 4435146 (1984-03-01), Wiatt et al.
patent: 4470797 (1984-09-01), Harry et al.
patent: 4588370 (1986-05-01), Ichizawa et al.
patent: 4592719 (1986-06-01), Bellehache et al.
patent: 4694951 (1987-09-01), Gibbemeyer
patent: 4721452 (1988-01-01), Delfer
patent: 4729732 (1988-03-01), Schad et al.
patent: 4786455 (1988-11-01), Krishnakumar et al.
patent: 4836767 (1989-06-01), Schad
patent: RE33237 (1990-06-01), Delfer
patent: 5052626 (1991-10-01), Wood et al.
patent: 5114327 (1992-05-01), Williamson et al.
patent: 5139724 (1992-08-01), Hofstetter et al.
patent: 5206039 (1993-04-01), Valyi
patent: 5232641 (1993-08-01), Williamson et al.
patent: 5232715 (1993-08-01), Fukai
patent: 5447426 (1995-09-01), Gessner et al.
patent: 5501593 (1996-03-01), Marcus
patent: 5514309 (1996-05-01), Williamson et al.
patent: 5569476 (1996-10-01), van Manen et al.
patent: 5582788 (1996-12-01), Collette et al.
patent: 5589130 (1996-12-01), Takada et al.
patent: 5653934 (1997-08-01), Brun et al.
patent: 5702734 (1997-12-01), Hartman et al.
patent: 5707662 (1998-01-01), Bright et al.
patent: 5762982 (1998-06-01), Knepper et al.
patent: 5772951 (1998-06-01), Coxhead
patent: 5876768 (1999-03-01), Collombin
patent: 6095788 (2000-08-01), van Manen et al.
patent: 6123538 (2000-09-01), Kutalowski
patent: 6139789 (2000-10-01), Neter
patent: 6143225 (2000-11-01), Domodossola et al.
patent: 6156258 (2000-12-01), Takada et al.
patent: 6290891 (2001-09-01), Galt
patent: 6299431 (2001-10-01), Neter
patent: 6299804 (2001-10-01), Domodossola
patent: 6422379 (2002-07-01), Zoppas
patent: 6428304 (2002-08-01), Sartor et al.
patent: 6488878 (2002-12-01), Neter et al.
patent: 6520765 (2003-02-01), van Manen
patent: 6663813 (2003-12-01), Neter
patent: 6837662 (2005-01-01), Rommes
patent: 6942480 (2005-09-01), Drysdale et al.
patent: 7077641 (2006-07-01), Hirasawatsu et al.
patent: 7094377 (2006-08-01), Coran
patent: 7128553 (2006-10-01), Shakal
patent: 7261547 (2007-08-01), Romanski
patent: 7264463 (2007-09-01), Domodossola
patent: 7632089 (2009-12-01), Bates et al.
patent: 7857614 (2010-12-01), Di Simone
patent: 2001/0038866 (2001-11-01), Giacobbe
patent: 2003/0091681 (2003-05-01), Drysdale et al.
patent: 2004/0115302 (2004-06-01), Rommes et al.
patent: 2005/0048159 (2005-03-01), Hirasawatsu et al.
patent: 2006/0138696 (2006-06-01), Weinmann
patent: 2006/0279023 (2006-12-01), Walsh
patent: 2010/0025188 (2010-02-01), Lanfranchi

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