Injection molded circuit housing

Details Injection molded circuit housing Injection molded circuit housing

1986-12-05

1988-08-23

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

361395, H05K 102

Patent

active

047665203

ABSTRACT:
An injection molded housing for thick film ignition circuitry used in conjunction with automobile or other vehicle engines includes an integral lead frame for providing electrical connections between the circuitry and engine sensors and ignition components. To provide protection against lead frame failure as a result of vibration and thermal stresses encountered in the engine environment, residual stress cracking caused by varying flexure of the lead frame during the manufacturing process is prevented by utilizing a pre-mold base in which the lead frame is placed prior to subsequent encapsulating of both the lead frame and the pre-molded base. The result is a lead-frame housing construction of greater reliability.

REFERENCES:
patent: 2478469 (1949-08-01), Earle
patent: 3469684 (1969-09-01), Keady et al.
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 4158745 (1979-06-01), Keller
patent: 4546412 (1985-10-01), Nakazawa et al.

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