Injection molded ball grid array casing

Details Injection molded ball grid array casing Injection molded ball grid array casing

1995-07-13

1998-11-24

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257737, 257787, 257778, 257774, H01L 23053

Patent

active

058411925

ABSTRACT:
A casing for mounting an integrated circuit chip includes an insulating plate, on the upper surface of which is disposed the chip. The upper surface is coated with an epoxy resin that extends from the upper surface of the plate up to at least the periphery of the lower surface of the plate.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5293092 (1994-03-01), Tsuji et al.
patent: 5557150 (1996-09-01), Variot et al.
patent: 5612576 (1997-03-01), Wilson et al.
French Search Report from French Patent Application No. 94 09251, filed Jul. 21, 1994.

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