Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With means to heat or cool
Patent
1993-03-24
1994-07-19
Heitbrink, Tim
Plastic article or earthenware shaping or treating: apparatus
Female mold and charger to supply fluent stock under...
With means to heat or cool
26432815, 425573, B29C 4520
Patent
active
053303490
ABSTRACT:
The present invention provides a gate apparatus for injection molding, that enables injection-molding moldings having a relatively small height and forming a plurality of cavities in an associated injection-molding die, the number of the cavities being greater than that of the cavities of the conventional injection-molding die of the same size. The gate assembly comprises an injection-molding die having a female die provided with a cavity, a down gate having an upper cylindrical portion, a middle taper portion and a lower small cylindrical hole formed in the lower end of the middle taper portion, and a cross gate formed through a wall separating the cavity and the lower small cylindrical hole; and a nozzle chip having a lower taper portion of a shape conforming to the middle taper portion of the down gate. The nozzle chip is provided with an axial projection axially projecting from the lower end of the lower taper portion, and a conical projection laterally projecting from the lower end of the axial projection. The nozzle chip is inserted in the down gate so that the conical projection is positioned near and opposite to the cross gate.
Fukushima Yuichi
Uchida Keiichiro
Heitbrink Tim
Kananen Ronald P.
Sony Corporation
LandOfFree
Injection mold having a cylindrical down gate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Injection mold having a cylindrical down gate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Injection mold having a cylindrical down gate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-516066