Injection mold for producing the housings of integrated circuits

Details Injection mold for producing the housings of integrated circuits Injection mold for producing the housings of integrated circuits

1986-03-04

1987-10-06

Nozick, Bernard

Static molds

Container-type molding device

Plural article forming mold, or molds with community feature

249 83, 249161, 425121, 425127, 425129R, 425572, 425588, 425589, 425595, B22C 920

Patent

active

046977848

ABSTRACT:
An injection mold is described for producing the housings of integrated circuits. The injection mold icludes a first mold half (30) in which are disposed a number of mold recesses (46) corresponding to the number of housings to be made simultaneously, having a depth corresponding to a portion of the height of the housings, and supply passages (48, 50, 52, 54, 56, 58) leading to the mold recesses (46). In a second mold half (32) which is adapted to be brought in the closure direction into engagement with the first mold half (30) a number of mold recesses (76) equal to the number in the first mold half (30) are disposed in corresponding arrangement, the depth thereof being equal to the remaining portion of the height of the housings to be made. The mold recesses (46) in one of the mold halves (32) are disposed groupwise in mold portions (64) which are held in the one mold half (32) displaceably in the closure and opening direction. The mold portions (64) are held in the closed state of the mold individually in force-locking manner in engagement on the other mold half (30).

REFERENCES:
patent: 2227966 (1941-01-01), Emsley
patent: 3050807 (1962-08-01), Clevemans
patent: 4332537 (1982-06-01), Slepcevic
patent: 4555086 (1985-11-01), Kiyotomo
patent: 4599062 (1986-07-01), Konishi

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