Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2005-02-22
2005-02-22
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S787000
Reexamination Certificate
active
06858933
ABSTRACT:
An injection mold is provided for encapsulating an integrated circuit chip to form a semiconductor package. The injection mold includes at least one injection cavity for housing the chip, and an insert having a front part that forms part of the wall of the injection cavity. A transverse surface of the insert has a roughness that is chosen such that the face of the semiconductor package has a suitable roughness in a corresponding region. Also provided is a semiconductor package that includes an encapsulation block and an integrated circuit chip. The material of the encapsulation block is transparent. One face of the chip includes an optical sensor and lies parallel to a transverse face of the encapsulation block. The transverse face of the encapsulation block includes a region that has a roughness that is less than the roughness of at least the rest of the transverse face.
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French Preliminary Search Report dated Feb. 20, 2001 for French Application No. 0006513.
Abela Jonathan
Prior Christophe
Bongini Stephen
Coleman W. David
Fleit Kain Gibbons Gutman Bongini & Bianco P.L.
Jorgenson Lisa K.
STMicroelectronics S.A.
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