Surgery – Means for introducing or removing material from body for... – Treating material introduced into or removed from body...
Reexamination Certificate
2006-02-07
2006-02-07
Kennedy, Sharon (Department: 3762)
Surgery
Means for introducing or removing material from body for...
Treating material introduced into or removed from body...
Reexamination Certificate
active
06994691
ABSTRACT:
An injection apparatus is described for making an injection at a predetermined depth in skin, including: a skin positioning member for positioning on a patch of skin within an area of skin such that at least a part of the patch of skin may be held elevated above or depressed below the area of skin, an injection needle, and a guidance mechanism for guiding the injection needle to slide beneath the skin positioning member to an injection position in which the distal end of the needle lies at a predetermined distance below the skin positioning member. An injection apparatus is also described including a detachable marker unit and a securing element for securing the marker unit at an injection site prior to the making of an injection to mark the position of the injection site.
REFERENCES:
patent: 2660169 (1953-11-01), Malm
patent: 2743723 (1956-05-01), Hein
patent: 3324854 (1967-06-01), Weese
patent: 4299219 (1981-11-01), Norris, Jr.
patent: 4573970 (1986-03-01), Wagner
patent: 4600403 (1986-07-01), Wagner
patent: 5364362 (1994-11-01), Schulz
patent: 5415647 (1995-05-01), Pisarik
patent: 6309374 (2001-10-01), Hecker et al.
patent: 6652487 (2003-11-01), Cook
patent: WO 00/02048 (2000-01-01), None
patent: WO 01/76665 (2001-10-01), None
patent: WO 02/30275 (2002-04-01), None
Kennedy Sharon
Nixon & Vanderhye PC
PreciSense A/S
LandOfFree
Injection apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Injection apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Injection apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3708468