Ingot support device in slicing apparatus

Stone working – Sawing – Rotary

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125 35, 51 73R, 83409, B28D 104

Patent

active

049497006

ABSTRACT:
A slicing apparatus is disclosed which slices a cylindrical ingot into disc-shaped wafers by a rotating blade. The slicing apparatus includes an ingot support device which is used to contact support the ingot at a position opposed to the position of the ingot to be sliced by the blade. Therefore, a rection force which is produced in the ingot slicing can be supported by the ingot support device, thereby eliminating any ill effects on the hold surface of the ingot.

REFERENCES:
patent: 3039235 (1962-06-01), Heinrich
patent: 3662733 (1972-05-01), Okamoto
patent: 3802412 (1974-04-01), Lane
patent: 3855738 (1974-12-01), Guggehheim, Sr. et al.
patent: 4228782 (1980-10-01), Demers et al.

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