Infrared ray cutoff material and infrared cutoff powder use for

Details Infrared ray cutoff material and infrared cutoff powder use for Infrared ray cutoff material and infrared cutoff powder use for

1994-06-30

1996-05-21

Nakarani, D. S.

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Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

252518, 252587, 427162, 427165, 427168, 4271631, 428329, 428331, 428426, 428518, 428689, 428702, B32B 516, C09D 533

Patent

active

055188109

ABSTRACT:
An infrared-ray cutoff material having a structure in which tin-doped indium oxide powder (ITO) powder is dispersed in an inorganic or organic matrix. The material can be in the form of a coating on a substrate available by applying a composition comprising ITO powder, a binder (an organic resin and/or a metal alkoxide) and a solvent (an organic solvent, water and/or alcohol) onto the substrate and drying the same. It may also be in the form of a film, a sheet, a fiber or other shape available by forming a composition made by dispersing ITO powder in an organic polymer. The ITO powder should preferably have an x-value of from 0.220 to 0.295 and a y-value of from 0.235 to 0.352 on the xy chromaticity scale, a lattice constant of from 10.110 to 10.160 .ANG., and a minimum cutoff wavelength of up to 1,000 nm. The infrared-ray cutoff material of the present invention is transparent within the visible region and can totally cut off infrared rays of wavelengths ranging from relatively shorter ones.

REFERENCES:
patent: 4937148 (1990-06-01), Sato et al.

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