Infrared detector hybrid array with improved thermal cycle relia

Details Infrared detector hybrid array with improved thermal cycle relia Infrared detector hybrid array with improved thermal cycle relia

1991-02-20

1993-11-23

Buczinski, Stephen C.

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

250332, 25037009, 25037013, 437 3, 437 5, 257436, 257442, 257460, 257469, G01J 520, H01L 2714

Patent

active

052646998

ABSTRACT:
A hybrid infrared focal plane array detector employs a thinned detector layer and substrate directly bonded to a conventional semiconductor readout integrated circuit substrate. The infrared detector layer and transparent substrate is thinned to a thickness of approximately 25-400.mu. to allow the detector to act like a flexible membrane to elastically respond to thermal mismatch due to differing coefficients of thermal expansion between the detector and semiconductor readout circuit as the hybrid device is cooled from manufacturing at room temperature to cryogenic operation temperatures. By thinning the detector substrate to a desired thickness, essentially unlimited hybrid detector sizes may be obtained. Additionally, the detector layer and substrate may be divided into sub-arrays to provide further resistance to stress induced from thermal mismatch.

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patent: 5047645 (1991-09-01), Gundjian et al.
patent: 5075201 (1991-12-01), Koh

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