Infrared data communication module and method of making the...

Details Infrared data communication module and method of making the... Infrared data communication module and method of making the...

2007-08-28

2007-08-28

Tran, Dzung (Department: 2613)

Optical communications

Optical communication over freee space

Transceivers

C398S138000, C398S164000

Reexamination Certificate

active

10127657

ABSTRACT:
An infrared data communication module includes a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted. A resin package is formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element. A shield member is formed within the resin package for covering the IC element to prevent light-attributable noises from reaching the IC element.

REFERENCES:
patent: 4469780 (1984-09-01), Hirai et al.
patent: 4493889 (1985-01-01), Mihara et al.
patent: 5391887 (1995-02-01), Murray, Jr.
patent: 6169295 (2001-01-01), Koo
patent: 6497588 (2002-12-01), Scharf et al.
patent: 2002/0005819 (2002-01-01), Ronzani et al.
patent: 2001-068722 (2001-03-01), None
English Language Abstract of JP-A-2001-068722.

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