Information processing apparatus, method of arranging components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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361724, 361785, 361704, 165122, 340625, 330100, H05K 720

Patent

active

06061238&

ABSTRACT:
An information processing apparatus includes a plurality of processor boards arranged parallelly on the main board and the DC--DC converters for generating operation voltages for processor devices each disposed between the adjacent processor boards. Further, a metal plate with high thermal conductivity is placed in close contact with an area of each of the processor boards where devices generating a large amount of heat are mounted. Heat dissipating fins are joined to the surface of each of the metal plates so that when the processor boards are mounted on the main board, the heat dissipating fins do not contact the DC--DC converter. The heat dissipating fins and the DC--DC converters are arranged so that they are vertically disposed one over the other with respect to the main board.

REFERENCES:
patent: 4511950 (1985-04-01), Bunner et al.
patent: 5218514 (1993-06-01), Huynh et al.
patent: 5961352 (1999-10-01), Denny et al.
Goodenough, "Here Comes VRM Controlling IC's Corresponding to the Latest Microprocessors One After Another", Nikkei Electronics, Jun. 2, 1997, pp. 113-116.

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