Information handling system utilizing circuitized substrate

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S255000, C174S264000, C361S792000, C361S795000, C439S074000

Reexamination Certificate

active

06872894

ABSTRACT:
An information handling system (e.g., computer, server, etc.) Utilizing at least one circuitized substrate assembly of robust construction and possessing enhanced operational capabilities. The substrate assemblies include a substrate having at least one opening which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

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IBM TDB, “Automatic Method For Registration And Stacking of Laminates”, by Hollis.
IBM TDB, “Multilayer Subsurface Circuit Board Constructions”, by Mace.

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