Information carrier and process for production thereof

Details Information carrier and process for production thereof Information carrier and process for production thereof

2005-08-09

2005-08-09

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S309600

Reexamination Certificate

active

06926794

ABSTRACT:
The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip1and a coil2connected to the IC chip are embedded in a substrate3composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.

REFERENCES:
patent: 4294643 (1981-10-01), Tadewald
patent: 4617216 (1986-10-01), Haghiri-Tehrani et al.
patent: 5585618 (1996-12-01), Droz
patent: 5856662 (1999-01-01), Kohama et al.

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