Metal fusion bonding – Including means to apply flux or filler to work or applicator – Gaseous flux
Patent
1993-10-12
1994-11-15
Bradley, P. Austin
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Gaseous flux
228219, 219390, 432 59, 432 64, B23K 300, B23K 3102
Patent
active
053640071
ABSTRACT:
An apparatus and method of reflow soldering electronic components, preferably to printed circuit boards, in an inert atmosphere to reduce solder defects and the need for flux or cleaning wherein the inert atmosphere is provided from a source of inert gas through several distribution lines which parallel the conveyor belt of a reflow solder furnace and supply each end of porous sintered metal diffuser tubes situated above the conveyor belt, as well as gas knives situated in baffle compartments at the inlet and outlet of the reflow solder furnace to strip barrier layers of oxygen atmosphere from the electronic components and preclude ingress of oxygen atmosphere into the reflow solder furnace.
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patent: 4921156 (1990-05-01), Hohnerlein
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patent: 5048746 (1991-09-01), Elliott et al.
patent: 5076487 (1991-12-01), Bandyopadhyay et al.
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Flattery, David K.; "Infrared Reflow Solder Attachment of Surface Mounted Devices"; Connective Technology; Feb. 1986; pp. 24-29.
Adams Bruce M.
Arslanian Gregory K.
Bowe Donald J.
Ivankovits John C.
Jacobs Stephen W.
Air Products and Chemicals Inc.
Bradley P. Austin
Chase Geoffrey L.
Elpel Jeanne M.
Marsh William F.
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